(주)디엠티

상세정보

Structure: Stacked XYT Linear stage
Application: Wafer 300mm

•Die to Wafer Hybird Bonding

Specifications:

•Size: 785 * 640 * 175T

•Travel(X, Y, T): 330 * 330 * 280°

•Payload: 2kg

•Max. Velocity: 200mm/s

•Bi-dir. Repeatability: ±0.5um

•Straightness: ±10.0um

•Flatness: ±10.0um

•Feedback: Linear Encoder

Lead time: 10 weeks (production)

•Prototype: 2022.04